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Proceedings Paper

Hybrid integration of InP photodetectors with SOI waveguides using thermocompression bonding
Author(s): Mikko Harjanne; Markku Kapulainen; Sami Ylinen; Timo Aalto; Jyrki Ollila; Ludwig Mörl; Wolfgang Passenberg
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Paper Abstract

In this paper we present the integration of an InP-based photodetector with silicon-on-insulator (SOI) waveguides using thermocompression bonding. A BCB prism integrated on top of the light-sensitive area of a planar detector (PD) chip deflects the light from a 4 μm thick SOI waveguide upward into the flip-chip bonded PD. A trench is etched in front of the SOI waveguide to accommodate prisms with apexes up to 7 μm. Using thermocompression bonding between thin gold pads (~500 nm thickness) deposited on both, SOI and photodetector chips an excellent vertical alignment accuracy of ±100 nm can be achieved, limited only by etching and Au-deposition tolerances. A commercial flip-chip bonder provides a lateral alignment accuracy also in the sub-micron range. Together with a previously developed process for integrating lasers and SOA chips using the same technology, fully functional PICs can now be realized on the SOI platform using thermocompression bonding.

Paper Details

Date Published: 18 May 2010
PDF: 11 pages
Proc. SPIE 7719, Silicon Photonics and Photonic Integrated Circuits II, 77190S (18 May 2010); doi: 10.1117/12.854403
Show Author Affiliations
Mikko Harjanne, VTT Technical Research Ctr. of Finland (Finland)
Markku Kapulainen, VTT Technical Research Ctr. of Finland (Finland)
Sami Ylinen, VTT Technical Research Ctr. of Finland (Finland)
Timo Aalto, VTT Technical Research Ctr. of Finland (Finland)
Jyrki Ollila, VTT Technical Research Ctr. of Finland (Finland)
Ludwig Mörl, Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut (Germany)
Wolfgang Passenberg, Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut (Germany)


Published in SPIE Proceedings Vol. 7719:
Silicon Photonics and Photonic Integrated Circuits II
Giancarlo Cesare Righini, Editor(s)

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