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Proceedings Paper

HELIOS: photonics electronics functional integration on CMOS
Author(s): Jean-Marc Fédéli; Laurent Fulbert; Dries Van Thourhout; Pierre Viktorovitch; Ian O'Connor; Guang-Hua Duan; Graham Reed; Francesco Della Corte; Laurent Vivien; Francisco Lopez Royo; Lorenzo Pavesi; Blas Garrido; Emmanuel Grard; Bernd Tillack; Lars Zimmermann; Stéphane Formont; Andreas Hakansson; Ewald Wachmann; Horst Zimmermann; Arjen Bakker; Henri Porte
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Paper Abstract

Silicon photonics have generated an increasing interest in the recent year, mainly for optical telecommunications or for optical interconnects in microelectronic circuits. The rationale of silicon photonics is the reduction of the cost of photonic systems through the integration of photonic components and an IC on a common chip, or in the longer term, the enhancement of IC performance with the introduction of optics inside a high performance chip. In order to build a Opto-Electronic Integrated circuit (OEIC), a large European project HELIOS has been launched two years ago. The objective is to combine a photonic layer with a CMOS circuit by different innovative means, using microelectronics fabrication processes. High performance generic building blocks that can be used for a broad range of applications are developed such as WDM sources by III-V/Si heterogeneous integration, fast Si modulators and Ge or InGaAs detectors, Si passive circuits and specific packaging. Different scenari for integrating photonic with an electronic chip and the recent advances on the building blocks of the Helios project are presented.

Paper Details

Date Published: 17 May 2010
PDF: 10 pages
Proc. SPIE 7719, Silicon Photonics and Photonic Integrated Circuits II, 771907 (17 May 2010); doi: 10.1117/12.853957
Show Author Affiliations
Jean-Marc Fédéli, CEA, LETI, Minatec (France)
Laurent Fulbert, CEA, LETI, Minatec (France)
Dries Van Thourhout, Univ. Gent (Belgium)
Pierre Viktorovitch, Institut des Nanotechnologies de Lyon, CNRS, Univ. de Lyon (France)
Ian O'Connor, Institut des Nanotechnologies de Lyon, CNRS, Univ. de Lyon (France)
Guang-Hua Duan, Alcatel-Thales III-V Lab. (France)
Graham Reed, Univ. of Surrey (United Kingdom)
Francesco Della Corte, Univ. Mediterranea di Reggio Calabria (Italy)
Laurent Vivien, Institut d'Electronique Fondamentale, CNRS, Univ. Paris Sud (France)
Francisco Lopez Royo, Univ. Politécnica de Valencia (Spain)
Lorenzo Pavesi, Univ. degli Studi di Trento (Italy)
Blas Garrido, Univ. de Barcelona (Spain)
Emmanuel Grard, 3S PHOTONICS SA (France)
Bernd Tillack, IHP GmbH (Germany)
Lars Zimmermann, Technische Univ. Berlin (Germany)
Stéphane Formont, Thales Airborne Systems (France)
Andreas Hakansson, DAS Photonics (Spain)
Ewald Wachmann, austriamicrosystems AG (Austria)
Horst Zimmermann, Technische Univ. Wien (Austria)
Arjen Bakker, PhoeniX B.V. (Netherlands)
Henri Porte, Photline Technologies (France)


Published in SPIE Proceedings Vol. 7719:
Silicon Photonics and Photonic Integrated Circuits II
Giancarlo Cesare Righini, Editor(s)

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