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Proceedings Paper

Measuring ultra-sonic in-plane vibrations with the scanning confocal heterodyne interferometer
Author(s): C. Rembe; F. Ur-Rehman; F. Heimes; S. Boedecker; A. Dräbenstedt
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Paper Abstract

The advanced progress in miniaturization technologies of mechanical systems and structures has led to a growing demand of measurement tools for three-dimensional vibrations at ultra-high frequencies. Particularly radio-frequency, micro-electro-mechanical (RF-MEM) technology is a planar technology and, thus, the resonating structures are much larger in lateral dimensions compared to the height. Consequently, most ultra-high-frequency devices have larger inplane vibration amplitudes than out-of-plane amplitudes. Recently, we have presented a heterodyne interferometer for vibration frequencies up to 1.2 GHz. In this paper we demonstrate a new method to extract broad-bandwidth spectra of in-plane vibrations with our new heterodyne interferometer. To accomplish this goal we have combined heterodyne interferometry, scanning vibrometry, edge-knife technique, amplitude demodulation, and digital-image processing. With our experimental setup we can realize in-plane vibration measurements up to 600 MHz. We will also show our first measurements of a broad-bandwidth, in-plane vibration around 200 MHz. Our in-plane and out-of-plane vibration measurements are phase-correlated and, therefore, our technique is suitable for broad-bandwidth, full-3D vibration measurements of ultrasonic microdevices.

Paper Details

Date Published: 14 May 2010
PDF: 12 pages
Proc. SPIE 7718, Optical Micro- and Nanometrology III, 771810 (14 May 2010); doi: 10.1117/12.853890
Show Author Affiliations
C. Rembe, Polytec GmbH (Germany)
F. Ur-Rehman, Polytec GmbH (Germany)
F. Heimes, Polytec GmbH (Germany)
S. Boedecker, Polytec GmbH (Germany)
A. Dräbenstedt, Polytec GmbH (Germany)


Published in SPIE Proceedings Vol. 7718:
Optical Micro- and Nanometrology III
Christophe Gorecki; Anand Krishna Asundi; Wolfgang Osten, Editor(s)

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