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Proceedings Paper

Advances in high-rate uncooled detector fabrication at Raytheon
Author(s): S. H. Black; R. Kraft; A. Medrano; T. Kocian; D. Bradstreet; R. Williams; T. Yang
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Paper Abstract

Over the past two years Raytheon has made a major investment aimed at establishing a high volume uncooled manufacturing capability. This effort has addressed three elements of the uncooled value stream, namely bolometer fabrication, packaging and calibration/test. To facilitate a low cost / high volume source of bolometers Raytheon has formed a partnership with a high volume 200mm commercial silicon wafer fabrication. Over a 12 month period Raytheon has installed 200mm VOx deposition equipment, matched the metrology used on the Raytheon 150mm line, transferred the process flow used to fabricate Raytheon's double layer bolometer process and qualified the product. In this paper we will review the process transfer methodology and bolometer performance. To reduce bolometer packaging cost and increase production rates, Raytheon has implemented an automated packaging line. This line utilizes automated adhesive dispense, component pick and place, wire bonding and solder seal. In this paper we will review the process flow, qualification process and line capacity Calibration and test has traditionally been performed using a number of temperature chambers, with increased throughput being obtained by adding more chambers. This comes at the expense of increased test labor required to feed the chambers and an increased energy and floor space foot print. To avoid these collateral costs, Raytheon has implemented an automated robotic calibration cell capable of performing in excess of 5,000 calibrations a month. In this paper we will provide an overview of the calibration cell along with takt time and throughput data.

Paper Details

Date Published: 3 May 2010
PDF: 12 pages
Proc. SPIE 7660, Infrared Technology and Applications XXXVI, 76600X (3 May 2010); doi: 10.1117/12.853675
Show Author Affiliations
S. H. Black, Raytheon Vision Systems (United States)
R. Kraft, Raytheon Vision Systems (United States)
A. Medrano, Raytheon Vision Systems (United States)
T. Kocian, Raytheon Vision Systems (United States)
D. Bradstreet, Raytheon Vision Systems (United States)
R. Williams, Raytheon Vision Systems (United States)
T. Yang, Raytheon Vision Systems (United States)


Published in SPIE Proceedings Vol. 7660:
Infrared Technology and Applications XXXVI
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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