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Proceedings Paper

A paradigm shift in scatterometry-based metrology solution addressing the most stringent needs of today as well as future lithography
Author(s): C. M. Ke; Victor Shih; Jacky Huang; L. J. Chen; Willie Wang; G. T. Huang; W. T. Yang; Sophia Wang; C. R. Liang; H. H. Liu; H. J. Lee; L. G. Terng; T. S. Gau; John Lin; Kaustuve Bhattacharyya; Maurits van der Schaar; Noelle Wright; Marc Noot; Mir Shahrjerdy; Vivien Wang; Spencer Lin; Jon Wu; Sophie Peng; Gavin Liu; Wei-Shun Tzeng; Jim Chen; Andreas Fuchs; Omer Adam; Cathy Wang
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Paper Abstract

Advanced lithography is becoming increasingly demanding when speed and sophistication in communication between litho and metrology (feedback control) are most crucial. Overall requirements are so extreme that all measures must be taken in order to meet them. This is directly driving the metrology resolution, precision and matching needs in to deep sub-nanometer level as well as driving the need for higher sampling (throughput). Keeping the above in mind, a new scatterometry-based platform (called YieldStar) is under development at ASML. Authors have already published results of a thorough investigation of this promising new metrology technique which showed excellent results on resolution, precision and matching for overlay, as well as basic and advanced capabilities for CD. In this technical presentation the authors will report the newest results taken from YieldStar. This new work is divided in two sections: monitor wafer applications and product wafer applications. Under the monitor wafer application: overlay, CD and focus applications will be discussed for scanner and track hotplate control. Under the product wafer application: first results from integrated metrology will be reported followed by poly layer and 3D CD reconstruction results from hole layers as well as overlay-results from small (30x60um), process-robust overlay targets are reported.

Paper Details

Date Published: 1 April 2010
PDF: 8 pages
Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 76383P (1 April 2010); doi: 10.1117/12.853318
Show Author Affiliations
C. M. Ke, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Victor Shih, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Jacky Huang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
L. J. Chen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Willie Wang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
G. T. Huang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
W. T. Yang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Sophia Wang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
C. R. Liang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. H. Liu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. J. Lee, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
L. G. Terng, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
T. S. Gau, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
John Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands)
Maurits van der Schaar, ASML Netherlands B.V. (Netherlands)
Noelle Wright, ASML Netherlands B.V. (Netherlands)
Marc Noot, ASML Netherlands B.V. (Netherlands)
Mir Shahrjerdy, ASML Netherlands B.V. (Netherlands)
Vivien Wang, ASML Netherlands B.V. (Netherlands)
Spencer Lin, ASML Netherlands B.V. (Netherlands)
Jon Wu, ASML Netherlands B.V. (Netherlands)
Sophie Peng, ASML Netherlands B.V. (Netherlands)
Gavin Liu, ASML Netherlands B.V. (Netherlands)
Wei-Shun Tzeng, ASML Netherlands B.V. (Netherlands)
Jim Chen, ASML Netherlands B.V. (Netherlands)
Andreas Fuchs, ASML Netherlands B.V. (Netherlands)
Omer Adam, ASML Netherlands B.V. (Netherlands)
Cathy Wang, ASML Netherlands B.V. (Netherlands)


Published in SPIE Proceedings Vol. 7638:
Metrology, Inspection, and Process Control for Microlithography XXIV
Christopher J. Raymond, Editor(s)

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