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Proceedings Paper

Thermal sensors based on nano porous silicon
Author(s): Jia-Chuan Lin; Wei-Chih Tsai; Meng-Kai Hsu; Hsi-Ting Hou; Yi-Hung Chen
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Paper Abstract

In this study, the thermal properties of silicon samples with surfaces of porous and geometrical formation were reported. The etching methods of anodization chemical and heated KOH were utilized to perform the studied nano porous silicon (NPS) and pyramidal, respectively. Compared with usual surface formation of ordinary silicon sample, the larger surface to volume ratios were obtained from the fabricated NPS and pyramidal silicon devices. For the thermal applications such as thermal sensor and microheater, the etching profiles and surface to volume ration of studied were clarified by SEM measurement. Furthermore, the differential scanning calorimetry (DSC) was used to evaluate the thermal dissipation properties of studied samples.

Paper Details

Date Published: 30 March 2010
PDF: 6 pages
Proc. SPIE 7646, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2010, 76461U (30 March 2010); doi: 10.1117/12.853184
Show Author Affiliations
Jia-Chuan Lin, St. John's Univ. (Taiwan)
Wei-Chih Tsai, National Cheng Kung Univ. (Taiwan)
Meng-Kai Hsu, St John's Univ. (Taiwan)
Hsi-Ting Hou, Tamkang Univ. (Taiwan)
Yi-Hung Chen, Chinese Culture Univ. (Taiwan)

Published in SPIE Proceedings Vol. 7646:
Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2010
Vijay K. Varadan, Editor(s)

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