Share Email Print
cover

Proceedings Paper

Three-dimensional stress analysis of O-ring under uniform squeeze and internal pressure by photoelastic experimental hybrid method
Author(s): J. S. Hawong; J. H. Nam; Y. Liu; D. C. Shin
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Until now, it is known that stresses on the plane (y-z plane) perpendicular to the circumferential direction (x axis) of Oring exist and stresses on the plane (x-y plane and x-z plane) parallel to the circumferential direction of O-ring does not exist when O-ring is under uniform squeeze rate and internal pressure. But it was known that stresses of x-y plane and xz plane of O-ring under uniform squeeze and internal pressure were existed by this research. To analyze 3 dimensional stress distributions of O-ring under those loadings, stress distributions of every plane should be analyzed. Therefore, photoelastic experimental hybrid method for 3 dimensional stress distributions of O-ring under uniform squeeze and internal pressure were developed in this research. Photoelastic experimental procedures for 3 dimensional stress distributions of O-ring under those loadings were introduced. Stress distributions of O-ring under those loadings were analyzed by photoelastic experimental hybrid method developed in this research. Von Mises equivalent stresses at arbitrary point of O-ring under those loadings were analyzed.

Paper Details

Date Published: 15 April 2010
PDF: 10 pages
Proc. SPIE 7522, Fourth International Conference on Experimental Mechanics, 75220B (15 April 2010); doi: 10.1117/12.853008
Show Author Affiliations
J. S. Hawong, Yeungnam Univ. (Korea, Republic of)
J. H. Nam, Yeungnam Univ. (Korea, Republic of)
Y. Liu, Yeungnam Univ. (Korea, Republic of)
D. C. Shin, Pusan National Univ. (Korea, Republic of)


Published in SPIE Proceedings Vol. 7522:
Fourth International Conference on Experimental Mechanics
Chenggen Quan; Kemao Qian; Anand Krishna Asundi; Fook Siong Chau, Editor(s)

© SPIE. Terms of Use
Back to Top