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Proceedings Paper

Small pixel uncooled imaging FPAs and applications
Author(s): Richard Blackwell; Glen Franks; Daniel Lacroix; Sandra Hyland; Robert Murphy
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Paper Abstract

BAE Systems continues to make dramatic progress in uncooled microbolometer sensors and applications. This paper will review the latest advancements in microbolometer technology at BAE Systems, including the development status of 17 micrometer pixel pitch detectors and imaging modules which are entering production and will be finding their way into BAE Systems products and applications. Benefits include increased die per wafer and potential benefits to SWAP for many applications. Applications include thermal weapons sights, thermal imaging modules for remote weapon stations, vehicle situational awareness sensors and mast/pole mounted sensors.

Paper Details

Date Published: 4 May 2010
PDF: 7 pages
Proc. SPIE 7660, Infrared Technology and Applications XXXVI, 76600Y (4 May 2010); doi: 10.1117/12.852970
Show Author Affiliations
Richard Blackwell, BAE Systems (United States)
Glen Franks, BAE Systems (United States)
Daniel Lacroix, BAE Systems (United States)
Sandra Hyland, BAE Systems (United States)
Robert Murphy, BAE Systems (United States)


Published in SPIE Proceedings Vol. 7660:
Infrared Technology and Applications XXXVI
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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