Share Email Print
cover

Proceedings Paper

Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors
Author(s): Hongtao Han; Keith Main
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mmx3.3mmx2.5mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.

Paper Details

Date Published: 2 December 2009
PDF: 7 pages
Proc. SPIE 7631, Optoelectronic Materials and Devices IV, 76311P (2 December 2009); doi: 10.1117/12.852776
Show Author Affiliations
Hongtao Han, Tessera North America (United States)
Keith Main, Tessera North America (United States)


Published in SPIE Proceedings Vol. 7631:
Optoelectronic Materials and Devices IV
Jian-Jun He; Guang-Hua Duan; Fumio Koyama; Ming C. Wu, Editor(s)

© SPIE. Terms of Use
Back to Top