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Proceedings Paper

Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors
Author(s): Hongtao Han; Keith Main
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Paper Abstract

Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mmx3.3mmx2.5mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.

Paper Details

Date Published: 2 December 2009
PDF: 7 pages
Proc. SPIE 7631, Optoelectronic Materials and Devices IV, 76311P (2 December 2009); doi: 10.1117/12.852776
Show Author Affiliations
Hongtao Han, Tessera North America (United States)
Keith Main, Tessera North America (United States)

Published in SPIE Proceedings Vol. 7631:
Optoelectronic Materials and Devices IV
Jian-Jun He; Guang-Hua Duan; Fumio Koyama; Ming C. Wu, Editor(s)

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