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Proceedings Paper

Directed assembly of block copolymers on lithographically defined surfaces
Author(s): Gordon S. W. Craig; Paul F. Nealey
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Paper Abstract

An outline of research on the directed assembly of block copolymer films to meet the needs of advanced lithographic systems, as defined by the International Technology Roadmap for Semiconductors, is presented. These requirements include pattern perfection, control of placement of features, the ability to generate patterns corresponding to regular fabric architectures, control of feature shapes and dimensions, scaling to below 10 nm, and pattern transfer. Accomplishments toward these requirements have been achieved by self-assembly with solvent annealing and by directed assembly on topographical or chemical patterns. Looking forward, these requirements must be met simultaneously, and examples are provided that show simultaneous achievement of many of these requirements. In addition, research focusing on specific implementation opportunities, such as directed assembly in 193 nm immersion lithography, is briefly discussed.

Paper Details

Date Published: 1 April 2010
PDF: 8 pages
Proc. SPIE 7637, Alternative Lithographic Technologies II, 76370L (1 April 2010); doi: 10.1117/12.852263
Show Author Affiliations
Gordon S. W. Craig, Univ. of Wisconsin-Madison (United States)
Paul F. Nealey, Univ. of Wisconsin-Madison (United States)


Published in SPIE Proceedings Vol. 7637:
Alternative Lithographic Technologies II
Daniel J. C. Herr, Editor(s)

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