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Proceedings Paper

Monolithic interconnection of CIGSSe solar cells by picosecond laser structuring
Author(s): Gerhard Heise; Christian Hellwig; Thomas Kuznicki; Sebastian Sarrach; Christian Menhard; Andreas Heiss; Helmut Vogt; Joerg Palm; Heinz P. Huber
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Paper Abstract

We report on the selective structuring of CIS (Cu(In,Ga)(S,Se)2) thin film solar cells applying picosecond lasers at 1064 nm. For a monolithic serial interconnection the thin layers are selectively separated by so called laser patterns 1, 2 and 3 (P1, P2 and P3). We demonstrate that the half micron thick molybdenum back electrode can be structured with a P1 process speed of more than 4 m/s without detectable residues and damages by direct induced laser ablation from the back side. A CIS layer (~2 μm thickness) is structured by standard direct laser ablation at higher energy densities and a process speed up to 200 mm/s. A 1.5 μm thick ZnO front electrode layer can be line separated with P3 speed up to several 1000 mm/s by indirect induced laser ablation. We demonstrate that direct induced (P1) and indirect induced (P3) picosecond laser ablation are not purely thermal processes working at energy densities far below the evaporation enthalpy. To increase the scribing speed elliptical and rectangular beam profiles were investigated. Validation of the processes for functionality within a CIS solar cell will be presented.

Paper Details

Date Published: 23 February 2010
PDF: 12 pages
Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 75850U (23 February 2010); doi: 10.1117/12.851907
Show Author Affiliations
Gerhard Heise, Munich Univ. of Applied Sciences (Germany)
Christian Hellwig, Munich Univ. of Applied Sciences (Germany)
Thomas Kuznicki, Munich Univ. of Applied Sciences (Germany)
Sebastian Sarrach, Munich Univ. of Applied Sciences (Germany)
Christian Menhard, Munich Univ. of Applied Sciences (Germany)
Andreas Heiss, Avancis GmbH & Co. KG (Germany)
Helmut Vogt, Avancis GmbH & Co. KG (Germany)
Joerg Palm, Avancis GmbH & Co. KG (Germany)
Heinz P. Huber, Munich Univ. of Applied Sciences (Germany)


Published in SPIE Proceedings Vol. 7585:
Laser-based Micro- and Nanopackaging and Assembly IV
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Jun Amako; Willem Hoving, Editor(s)

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