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Proceedings Paper

Comparative study of residual stress measurement techniques with high spatial resolution
Author(s): Dietmar Vogel; Ingrid Maus; Florian Schindler-Saefkow; Bernd Michel
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Paper Abstract

Three different methods of stress measurement with strong spatial resolution are presented. They base on stress relief techniques caused by focused ion beam milling, on altered electron backscattering by deformed lattices and on Stokes line shift measurements by Raman spectroscopy. The capability of these methods is demonstrated by their application to typical MEMS structures. A comparison between the methods is performed in order to outline potentials and limitations.

Paper Details

Date Published: 14 April 2010
PDF: 8 pages
Proc. SPIE 7522, Fourth International Conference on Experimental Mechanics, 752224 (14 April 2010); doi: 10.1117/12.851853
Show Author Affiliations
Dietmar Vogel, Fraunhofer-Einrichtung für Elektronische Nanosysteme (Germany)
Ingrid Maus, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Florian Schindler-Saefkow, Fraunhofer-Einrichtung für Elektronische Nanosysteme (Germany)
Bernd Michel, Fraunhofer-Einrichtung für Elektronische Nanosysteme (Germany)


Published in SPIE Proceedings Vol. 7522:
Fourth International Conference on Experimental Mechanics
Chenggen Quan; Kemao Qian; Anand Krishna Asundi; Fook Siong Chau, Editor(s)

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