Share Email Print
cover

Proceedings Paper

Transfer of micro/nano-scale pillars and wires on conducting thermoplastic composite coated arbitrary substrates
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper, we demonstrate an approach to simultaneously transfer single crystal devices in the shape of vertically oriented 1-D silicon micropillars, while establishing a direct electrical and mechanical connection to a target surface of any topology using an innovative harvest/lift-off process coupled with a conducting thermoplastic composing of polyaniline (PAni) and polymethylmethacrylate (PMMA) composite. The mixture acts as a stable anchoring layer and as a conducting layer for the bottom electrode. The insulating layer comprised of PMMA while the top electrode can be formed by evaporating thin metal films.

Paper Details

Date Published: 28 April 2010
PDF: 7 pages
Proc. SPIE 7683, Energy Harvesting and Storage: Materials, Devices, and Applications, 768313 (28 April 2010); doi: 10.1117/12.851762
Show Author Affiliations
Logeeswaran V. Jayaraman, Univ. of California, Davis (United States)
Matthew Ombaba, Univ. of California, Davis (United States)
Aaron M. Katzenmeyer, Univ. of California, Davis (United States)
M. Saif Islam, Univ. of California, Davis (United States)


Published in SPIE Proceedings Vol. 7683:
Energy Harvesting and Storage: Materials, Devices, and Applications
Nibir K. Dhar; Priyalal S. Wijewarnasuriya; Achyut Kumar Dutta, Editor(s)

© SPIE. Terms of Use
Back to Top