Share Email Print
cover

Proceedings Paper

Low-power XGA thermal camera for ground applications
Author(s): Stanley Kummer
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The advent of uncooled infrared, XGA (1024×768) focal plane arrays (FPAs) enables new applications for ground vehicles and soldier equipment. A low-power digital imaging module, based on a 17μm-pitch FPA, has been developed and packaged in a rugged housing for demonstration in a distributed aperture system. Cameras and the embedded thermal imaging modules have been delivered during 2009 and the module will be commercially available in 2010. This new capability can extend the performance of existing uncooled ground-based systems. Some background is presented. The product is described and several applications are introduced.

Paper Details

Date Published: 3 May 2010
PDF: 7 pages
Proc. SPIE 7660, Infrared Technology and Applications XXXVI, 76600C (3 May 2010); doi: 10.1117/12.851738
Show Author Affiliations
Stanley Kummer, L-3 Communications Corp. (United States)


Published in SPIE Proceedings Vol. 7660:
Infrared Technology and Applications XXXVI
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

© SPIE. Terms of Use
Back to Top