Share Email Print
cover

Proceedings Paper

Effect of powder contents on stress relaxation of glass powder reinforced epoxy
Author(s): T. Sakai; K. Okabe; S. Yoneyama
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Glass powder reinforced epoxy was used in the fields of plastic sealing of semiconductor devices. In such environment, the materials were exposed in the high temperature, and the stress relaxation behavior must occur in the materials. Therefore, the analysis of stress relaxation behavior was needed. The stress relaxation behaviors of epoxy composites filled with different amounts of glass powder were investigated. Master curves of stress relaxation were obtained, and time-temperature superposition principle was observed on perpetrated epoxy composites. The slopes of time-temperature shift factors were changed depended on the amount of glass powder. It is therefore, we can calculate the timetemperature shift factors by using this relationship. The effect of amounts of glass powder on stress relaxation was investigated, too. Comparing the master curves of stress relaxation with the different amount of glass powder, it is understood that the stress relaxation behaviors of both materials are the same. And it is explained that the effect of glass powder contents on stress relaxation behavior is the effect of reinforcement and heat resistance.

Paper Details

Date Published: 14 April 2010
PDF: 6 pages
Proc. SPIE 7522, Fourth International Conference on Experimental Mechanics, 752242 (14 April 2010); doi: 10.1117/12.851605
Show Author Affiliations
T. Sakai, Tokyo Metropolitan Univ. (Japan)
K. Okabe, Aoyama Gakuin Univ. (Japan)
S. Yoneyama, Aoyama Gakuin Univ. (Japan)


Published in SPIE Proceedings Vol. 7522:
Fourth International Conference on Experimental Mechanics
Chenggen Quan; Kemao Qian; Anand Krishna Asundi; Fook Siong Chau, Editor(s)

© SPIE. Terms of Use
Back to Top