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Proceedings Paper

PC floor systems for microelectronics manufacturing buildings
Author(s): Kappyo Hong; Seongsoo Lee; Yunhan Kwon; Homin Chun; Kwangsu Cho; Sijun Kim
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Paper Abstract

Because a PC(Precast Concrete) system has to follow the transportation rules for transporting PC units and be designed to the specifications of the tools and equipment on site, designing long-span PC systems for microelectronics manufacturing facilities can be troublesome due to complications in transporting, lifting and handling the PC units. To resolve these problems that can occur in long span and heavy weight PC designs, this study proposes two types of long-span PC floor systems that practically use the traditional Gerber beam concept. In the proposed systems, long-span (17.4m) girders or beams are segmented into appropriate lengths using the Gerber system for easy delivery and lifting. Moreover, these systems provide the ability to optimally design massive units by controlling the location of hinge points. On the other hand, because continuous long-span girders or beams are segmented into the Gerber system's hinge points, these systems may generate structural stability problems during construction. Consequently, this study experimentally examines the structural performance of stress transfer mechanism in panel zones and the construction stability of PC units for columns and girders during assembly.

Paper Details

Date Published: 14 April 2010
PDF: 9 pages
Proc. SPIE 7522, Fourth International Conference on Experimental Mechanics, 75225M (14 April 2010); doi: 10.1117/12.851576
Show Author Affiliations
Kappyo Hong, Yonsei Univ. (Korea, Republic of)
Seongsoo Lee, Kunsan National Univ. (Korea, Republic of)
Yunhan Kwon, Samsung Engineering Co., Ltd. (Korea, Republic of)
Homin Chun, Chodang Univ. (Korea, Republic of)
Kwangsu Cho, Samsung Engineering Co., Ltd. (Korea, Republic of)
Sijun Kim, Yonsei Univ. (Korea, Republic of)

Published in SPIE Proceedings Vol. 7522:
Fourth International Conference on Experimental Mechanics
Chenggen Quan; Kemao Qian; Anand Krishna Asundi; Fook Siong Chau, Editor(s)

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