Share Email Print
cover

Proceedings Paper

Circular apertures for contact hole patterning in 193-nm immersion lithography
Author(s): Cho Jui Tay; Chenggen Quan; Moh Lung Ling; Qunying Lin; Sia Kim Tan; Gek Soon Chua
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

A novel concept of contact holes patterning for 193 nm immersion lithography is demonstrated in this study. Conventional contact holes patterning involve targeting a square printed feature on the wafer and applying optical proximity correction (OPC) such as corner serifs addition and dimensional biasing. As dimension of contact holes reduces, the resolution enhancement provided by conventional OPC methods has become limited. This is because at smaller dimension, more light is diffracted towards higher order and is not captured in the pupil plane. As a result, the corners of the printed features are rounded and features appear circular as dimension reduces. Hence, the efforts made to generate OPC assist features using a square target are inefficient. In this paper, the patterning of contact hole using circular target is demonstrated. The imaging performance of isolated and regular contact holes array is reported. Comparison with conventional approach is made. The effects of the proposed method on critical dimension (CD), depth of focus (DOF), and image contrast is investigated.

Paper Details

Date Published: 15 April 2010
PDF: 9 pages
Proc. SPIE 7522, Fourth International Conference on Experimental Mechanics, 752251 (15 April 2010); doi: 10.1117/12.851318
Show Author Affiliations
Cho Jui Tay, National Univ. of Singapore (Singapore)
Chenggen Quan, National Univ. of Singapore (Singapore)
Moh Lung Ling, National Univ. of Singapore (Singapore)
Qunying Lin, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Sia Kim Tan, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Gek Soon Chua, Chartered Semiconductor Manufacturing Ltd. (Singapore)


Published in SPIE Proceedings Vol. 7522:
Fourth International Conference on Experimental Mechanics
Chenggen Quan; Kemao Qian; Anand Krishna Asundi; Fook Siong Chau, Editor(s)

© SPIE. Terms of Use
Back to Top