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Proceedings Paper

Constitutive equation for hardened SKD11 steel at high temperature and high strain rate using the SHPB technique
Author(s): D. W. Tang; C. Y. Wang; Y. N. Hu; Y. X. Song
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Paper Abstract

In this present work, dynamic tests have been performed on hardened SKD11 steel (62 Rockwell C hardness) specimens by means of a high temperature split Hopkinson pressure bar (SHPB) test system. Effects of temperature as well as those of strain and strain rate for the hardened steel are taken into account by using two ellipsoidal radiant heating reflectors with two halogen lamps and magnetic valve. The result obtained at high stain rates were compared with those at low strain rates under the different temperature. It was seen that the flow stress curves are found to include a work hardening region and a work softening region and the mechanical behavior of the hardened steel is highly sensitive to both the strain rate and the temperature. To determine the true flow stress- true strain, temperature relationship, specimens are tested from room temperature to 1073K at a strain rate form 0.01 s-1 to 104 s-1: The parameters for a Johnson-Cook constitutive equation and a modified Johnson-Cook constitutive equation are determined from the test results by fitting the data from both quasi-static compression and high temperature-dynamic compression tests. The modified Johnson-Cook constitutive equation is more suitable for expressing the dynamic behavior of the hardened SKD11 steel above the vicinity of the recrystallization temperature.

Paper Details

Date Published: 14 April 2010
PDF: 12 pages
Proc. SPIE 7522, Fourth International Conference on Experimental Mechanics, 75226B (14 April 2010); doi: 10.1117/12.851262
Show Author Affiliations
D. W. Tang, Guangdong Univ. of Technology (China)
C. Y. Wang, Guangdong Univ. of Technology (China)
Y. N. Hu, Guangxi Univ. (China)
Y. X. Song, Guangdong Univ. of Technology (China)

Published in SPIE Proceedings Vol. 7522:
Fourth International Conference on Experimental Mechanics
Chenggen Quan; Kemao Qian; Anand Krishna Asundi; Fook Siong Chau, Editor(s)

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