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Proceedings Paper

CSI Helsinki: comparing three-dimensional imaging of diagonal cutter toolmarks using confocal microscopy and SWLI
Author(s): I. Kassamakov; C. Barbeau; S. Lehto; P. Ahvenainen; T. Reinikainen; E. Hæggström
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Paper Abstract

Cutting tools leave characteristic marks that can connect a set of toolmarks to an individual tool. When the depth resolution of an optical microscope is insufficient, more advanced three-dimensional (3D) imaging methods such as Scanning White Light Interferometry (SWLI) and confocal microscopy are required. We cut ten copper wires (2.1±0.1 mm diameter) maintaining a predefined blade orientation and position using diagonal cutting pliers. Images of the sample surfaces were created using equipment based on optical microscopy, SWLI and confocal microscopy. SWLI and confocal microscopy set-ups can produce consistent high-resolution 3D images that are relevant for forensic toolmark comparison.

Paper Details

Date Published: 15 May 2010
PDF: 9 pages
Proc. SPIE 7690, Three-Dimensional Imaging, Visualization, and Display 2010 and Display Technologies and Applications for Defense, Security, and Avionics IV, 76900Y (15 May 2010); doi: 10.1117/12.850046
Show Author Affiliations
I. Kassamakov, Univ. of Helsinki (Finland)
C. Barbeau, Forensic Technology WAI Inc. (Canada)
S. Lehto, National Bureau of Investigation (Finland)
P. Ahvenainen, Univ. of Helsinki (Finland)
T. Reinikainen, National Bureau of Investigation (Finland)
E. Hæggström, Univ. of Helsinki (Finland)


Published in SPIE Proceedings Vol. 7690:
Three-Dimensional Imaging, Visualization, and Display 2010 and Display Technologies and Applications for Defense, Security, and Avionics IV
Bahram Javidi; Jung-Young Son; John Tudor Thomas; Daniel D. Desjardins, Editor(s)

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