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Proceedings Paper

A digital 25 µm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massive parallel Sigma-Delta-ADC readout
Author(s): Dirk Weiler; Marco Russ; Daniel Würfel; Renee Lerch; Pin Yang; Jochen Bauer; Holger Vogt
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Paper Abstract

This paper presents an advanced 640 x 480 (VGA) IRFPA based on uncooled microbolometers with a pixel-pitch of 25μm developed by Fraunhofer-IMS. The IRFPA is designed for thermal imaging applications in the LWIR (8 .. 14μm) range with a full-frame frequency of 30 Hz and a high sensitivity with NETD < 100 mK @ f/1. A novel readout architecture which utilizes massively parallel on-chip Sigma-Delta-ADCs located under the microbolometer array results in a high performance digital readout. Sigma-Delta-ADCs are inherently linear. A high resolution of 16 bit for a secondorder Sigma-Delta-modulator followed by a third-order digital sinc-filter can be obtained. In addition to several thousand Sigma-Delta-ADCs the readout circuit consists of a configurable sequencer for controlling the readout clocking signals and a temperature sensor for measuring the temperature of the IRFPA. Since packaging is a significant part of IRFPA's price Fraunhofer-IMS uses a chip-scaled package consisting of an IR-transparent window with antireflection coating and a soldering frame for maintaining the vacuum. The IRFPAs are completely fabricated at Fraunhofer-IMS on 8" CMOS wafers with an additional surface micromachining process. In this paper the architecture of the readout electronics, the packaging, and the electro-optical performance characterization are presented.

Paper Details

Date Published: 4 May 2010
PDF: 8 pages
Proc. SPIE 7660, Infrared Technology and Applications XXXVI, 76600S (4 May 2010); doi: 10.1117/12.849839
Show Author Affiliations
Dirk Weiler, Fraunhofer Institute of Microelectronic Circuits and Systems (Germany)
Marco Russ, Fraunhofer Institute of Microelectronic Circuits and Systems (Germany)
Daniel Würfel, Fraunhofer Institute of Microelectronic Circuits and Systems (Germany)
Renee Lerch, Fraunhofer Institute of Microelectronic Circuits and Systems (Germany)
Pin Yang, Fraunhofer Institute of Microelectronic Circuits and Systems (Germany)
Jochen Bauer, Fraunhofer Institute of Microelectronic Circuits and Systems (Germany)
Holger Vogt, Fraunhofer Institute of Microelectronic Circuits and Systems (Germany)


Published in SPIE Proceedings Vol. 7660:
Infrared Technology and Applications XXXVI
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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