Share Email Print

Proceedings Paper

Hybridization process for back-illuminated silicon Geiger-mode avalanche photodiode arrays
Author(s): Daniel R. Schuette; Richard C. Westhoff; Andrew H. Loomis; Douglas J. Young; Joseph S. Ciampi; Brian F. Aull; Robert K. Reich
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We present a unique hybridization process that permits high-performance back-illuminated silicon Geiger-mode avalanche photodiodes (GM-APDs) to be bonded to custom CMOS readout integrated circuits (ROICs) - a hybridization approach that enables independent optimization of the GM-APD arrays and the ROICs. The process includes oxide bonding of silicon GM-APD arrays to a transparent support substrate followed by indium bump bonding of this layer to a signal-processing ROIC. This hybrid detector approach can be used to fabricate imagers with high-fill-factor pixels and enhanced quantum efficiency in the near infrared as well as large-pixel-count, small-pixel-pitch arrays with pixel-level signal processing. In addition, the oxide bonding is compatible with high-temperature processing steps that can be used to lower dark current and improve optical response in the ultraviolet.

Paper Details

Date Published: 28 April 2010
PDF: 7 pages
Proc. SPIE 7681, Advanced Photon Counting Techniques IV, 76810P (28 April 2010); doi: 10.1117/12.849356
Show Author Affiliations
Daniel R. Schuette, MIT Lincoln Lab. (United States)
Richard C. Westhoff, MIT Lincoln Lab. (United States)
Andrew H. Loomis, MIT Lincoln Lab. (United States)
Douglas J. Young, MIT Lincoln Lab. (United States)
Joseph S. Ciampi, MIT Lincoln Lab. (United States)
Brian F. Aull, MIT Lincoln Lab. (United States)
Robert K. Reich, MIT Lincoln Lab. (United States)

Published in SPIE Proceedings Vol. 7681:
Advanced Photon Counting Techniques IV
Mark A. Itzler; Joe C. Campbell, Editor(s)

© SPIE. Terms of Use
Back to Top