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Proceedings Paper

Integration of encapsulated piezoelectric actuators in highly loaded CFRP structures
Author(s): Florian Bachmann; Paolo Ermanni
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Paper Abstract

The present work has been initiated in the frame of the European research project DREAM. Within this highly interdisciplinary project we are focusing on the development and application of vibration damping solutions based on piezoelectric shunt circuits for future aeroelastic applications. The scientific community has put significant effort into the investigation of piezoelectric shunt damping in conjuction with typical engineering test structures such as beams and plates. However, investigations are mainly restricted to surface bonded piezoelectric elements. Commercially available actuators and sensors can be easily bonded to structures using standard epoxy resins. Yet, the structural integration into composite laminates is cumbersome, due to the implications in terms of overall structural integrity and functionality, and due to the problems in achieving a good electrical conductivity, intimate contact betwen electrode and piezoceramic material as well as a perfect isolation from the surrounding host structure. This contribution is concerned with technological aspects related to the integration of piezoceramic actuators into highly loaded CFRP structures. In particular, we present results of a comparative study aiming at the characterization of less invasive electrodes to establish electrical contact between the piezoceramic material and possible shunt circuits. Another drawback of commercial actuators are their limited strain allowables ranging from 0.1% to 0.3% which is not sufficient for high performance lighweight structures. The second part of this contribution is therefore dedicated to the description of a novel prestressing procedure which is used to fabricate actuators that command 170% higher strain allowables than non-prestressed actuators. Mechanical testing of these prestressed actuators are very encouraging, showing high strain allowables, perfect electrical isolation from the host structure, excellent electric contacting of the piezoelectric material and reliable functionality even when applied to curved structures.

Paper Details

Date Published: 9 April 2010
PDF: 12 pages
Proc. SPIE 7643, Active and Passive Smart Structures and Integrated Systems 2010, 76432H (9 April 2010); doi: 10.1117/12.849016
Show Author Affiliations
Florian Bachmann, ETH Zürich (Switzerland)
Paolo Ermanni, ETH Zürich (Switzerland)


Published in SPIE Proceedings Vol. 7643:
Active and Passive Smart Structures and Integrated Systems 2010
Mehrdad N. Ghasemi-Nejhad, Editor(s)

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