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Proceedings Paper

Aqueous and solvent developed negative-tone molecular resists
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Paper Abstract

A series of negative tone molecular resists was investigated for use in both organic solvent and aqueous base development. Molecular resists designed purely for solvent development showed half-pitch resolution down to 25 nm with sensitivities of 50 μC/cm2 and LER (3σ) down to 2.3 nm. Aqueous developable designs that used epoxide functionalized molecules that are intrinsically water soluble showed improved contrast and comparable sensitivity, but suffered from significant dewetting during baking due to their low molecular weight and high polarity. This inability to form high quality films prevented their use as high resolution resists. Aqueous developable designs that used molecules with both cross-linking and base solubilizing groups were also investigated; the initial example of this design is DPA- 2Ep, a molecular resist containing two epoxides and one carboxylic acid per molecule. It formed high quality films and showed improved contrast compared to the purely solvent developed designs. Even after complete cross-linking of the epoxide groups, several free carboxylic acids still remained in the network. These free acids tend to imbibe developer and appear to retain the tetramethylammonium carboxylates even after rinsing and drying the film. This imbibing of developer leads to significant failure during high resolution patterning due to swelling.

Paper Details

Date Published: 25 March 2010
PDF: 13 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76390O (25 March 2010); doi: 10.1117/12.848414
Show Author Affiliations
Richard A. Lawson, Georgia Institute of Technology (United States)
Jing Cheng, Georgia Institute of Technology (United States)
David E. Noga, Georgia Institute of Technology (United States)
Todd R. Younkin, Intel Corp. (United States)
Laren M. Tolbert, Georgia Institute of Technology (United States)
Clifford L. Henderson, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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