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Proceedings Paper

Adhesion of DNA nanostructures and DNA origami to lithographically patterned self-assembled monolayers on Si[100]
Author(s): Koshala Sarveswaran; Bo Gao; Kyoung Nan Kim; Gary H. Bernstein; Marya Lieberman
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Paper Abstract

Cationic self-assembled monolayers (SAMs) can easily be formed on silicon dioxide via siloxane chemistry, and these SAMs provide robustly attached surface charges that anchor DNA nanostructures and origami. The surface charge of the SAM can be controlled by formation of mixed monolayers of aminopropyltriethoxysilane (APTES) and trimethyl aminopropyltrimethoxysilyl chloride (TMAC). X-ray photoelectron spectra of mixed monolayers show surface charges ranging from about 1 to 3 charges per nm2. At high mole fractions of APTES, binding defects such as folded and rolled origami are common; at moderate mole fractions of APTES, binding metrics for DNA origami are comparable to mica, and on pure TMAC, binding is weaker than on mica. In order to locate individual DNA nanostructures at desired sites, 35-40 nm APTES dots or 125 nm APTES stripes were fabricated by a combination of EBL and molecular liftoff. Deposition of small DNA nanostructures (8 nm × 37 nm × 2 nm) or DNA origami (60 nm × 90 nm) was conducted in 0.1-1.0 micromolar solution. The binding selectivity between the anchor pads and the background silicon dioxide was at least 50:1. The DNA origami are persistently attached and can be imaged in air after rinsing the substrate in flowing water.

Paper Details

Date Published: 2 April 2010
PDF: 13 pages
Proc. SPIE 7637, Alternative Lithographic Technologies II, 76370M (2 April 2010); doi: 10.1117/12.848392
Show Author Affiliations
Koshala Sarveswaran, Univ. of Notre Dame (United States)
Bo Gao, Univ. of Notre Dame (United States)
Kyoung Nan Kim, Univ. of Notre Dame (United States)
Gary H. Bernstein, Univ. of Notre Dame (United States)
Marya Lieberman, Univ. of Notre Dame (United States)


Published in SPIE Proceedings Vol. 7637:
Alternative Lithographic Technologies II
Daniel J. C. Herr, Editor(s)

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