Share Email Print

Proceedings Paper

Method for wafer edge profile extraction using optical images obtained in edge defect inspection process
Author(s): Hiroaki Okamoto; Naoshi Sakaguchi; Fuminori Hayano
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

It is becoming increasingly important to monitor wafer edge profiles in the immersion lithography era. A Nikon edge defect inspection tool acquires the circumferential optical images of the wafer edge during its inspection process. Nikon's unique illumination system and optics make it possible to then convert the brightness data of the captured images to quantifiable edge profile information. During this process the wafer's outer shape is also calculated. Test results show that even newly shipped bare wafers may not have a constant shape over 360 degree. In some cases repeated deformations with 90 degree pitch are observed.

Paper Details

Date Published: 1 April 2010
PDF: 10 pages
Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 763826 (1 April 2010); doi: 10.1117/12.848315
Show Author Affiliations
Hiroaki Okamoto, Nikon Corp. (Japan)
Naoshi Sakaguchi, Nikon Corp. (Japan)
Fuminori Hayano, Nikon Corp. (Japan)

Published in SPIE Proceedings Vol. 7638:
Metrology, Inspection, and Process Control for Microlithography XXIV
Christopher J. Raymond, Editor(s)

© SPIE. Terms of Use
Back to Top