Share Email Print

Proceedings Paper

Preliminary results for photomask haze mitigation in a fab environment
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A persistent industry problem impacting photomask yield and costs has been haze formation. The haze nucleation and growth phenomenon on critical photomask surfaces has periodically gained attention as it has significantly impacted wafer printability for different technology nodes over the years. A number of process solutions have been promoted in the semiconductor industry which has been shown to suppress or minimize the propensity for haze formation, but none of these technologies can stop every instance of haze. Thus some capability will always be needed to remove haze on photomasks with their final pellicles mounted both at the manufacture and long term maintenance stages of a mask's lifetime. A novel technology is reviewed here which uses a dry (no chemical effluents) removal system to sweep the entire printable region of a pelliclized photomask to eliminate all removable haze regardless of the mask substrate materials or the presence of critical patterns. An operational process technique for this system and performance in removal is shown for haze located on the mask pattern surface. Finally, preliminary data from tool acceptance and preliminary use in a production environment will also be reviewed.

Paper Details

Date Published: 1 April 2010
PDF: 13 pages
Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 763817 (1 April 2010); doi: 10.1117/12.848283
Show Author Affiliations
Thomas Ku, GLOBAL FOUNDRIES Inc. (Singapore)
Jeff LeClaire, RAVE LLC (United States)
Sia Kim Tan, GLOBAL FOUNDRIES Inc. (Singapore)
Gek Soon Chua, GLOBAL FOUNDRIES Inc. (Singapore)
Ron Bozak, RAVE LLC (United States)
Roy White, RAVE LLC (United States)
Tod Robinson, RAVE LLC (United States)
Michael Archuletta, RAVE LLC (United States)
David Lee, RAVE LLC (United States)

Published in SPIE Proceedings Vol. 7638:
Metrology, Inspection, and Process Control for Microlithography XXIV
Christopher J. Raymond, Editor(s)

© SPIE. Terms of Use
Back to Top