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Proceedings Paper

Improved thermal flow characteristic resist optimized for the manufacturing of microlenses
Author(s): Medhat A. Toukhy; Margareta Puanescu; Stephen Meyer
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Paper Abstract

A newly developed chemically amplified (CA) i-line positive resist is designed to reflow the resist structures at relatively low temperatures while eliminating thermal crosslinking mechanisms. The resist can reflow to form clear spherical lenses having greater than 90° contact angles. This is demonstrated by thermally reflowing squared resist posts, 50μm and 80μm in size printed in 48μm resist thickness and 10μm posts in 15μm thickness at 120°C. The resulting lenses have smooth surfaces, free of any wrinkling or residual resist corners.

Paper Details

Date Published: 29 March 2010
PDF: 7 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763911 (29 March 2010); doi: 10.1117/12.848250
Show Author Affiliations
Medhat A. Toukhy, AZ Electronic Materials USA Corp. (United States)
Margareta Puanescu, AZ Electronic Materials USA Corp. (United States)
Stephen Meyer, AZ Electronic Materials USA Corp. (United States)


Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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