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Proceedings Paper

Methods and challenges to extend existing dry 193nm medium NA lithography beyond 90nm
Author(s): Jens Schneider; Andreas Greiner; ChinTeong Lim; Vlad Temchenko; Felix Braun; Dieter Kaiser; Tarja Hauck; Ingo Meusel; Dietrich Burmeister; Stephan Loehr; Susanne Volkland; Astrid Bauch; Hendrik Kirbach; Daniel Sarlette; Katrin Thiede
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Paper Abstract

In order to fulfill the demands of further shrinkage of our mature 90nm logic litho technologies under the constraints of costs and available toolsets in a 200mm fab environment, a project called "Push to the Limits" was started. The aim ís to extend the lifetime and capabilities of existing dry 193nm litho toolsets with medium to low numerical aperture, coupled with the availability of materials and processes which were known to help up CD miniaturization and to shrink the 90nm logic litho process as far as possible. To achieve this, various options were explored and evaluated, e.g. optimization of illumination conditions, evaluation of new materials, usage of advanced RET techniques (OPC, LfD, DfM and ILT) and resolution enhancement by chemical shrink (RELACS®). In this project we demonstrate how we were able to extend our existing 90nm technology capability, down close to 65nm node litho requirements on most critical layers. We present overall result in most critical layer generally and specifically on most difficult layer of contact. Typical contact litho target at 100nm region was enabled, while realization of 90nm ADI target is possible with addition of new process materials.

Paper Details

Date Published: 4 March 2010
PDF: 10 pages
Proc. SPIE 7640, Optical Microlithography XXIII, 76403G (4 March 2010); doi: 10.1117/12.848207
Show Author Affiliations
Jens Schneider, Infineon Technologies Dresden GmbH (Germany)
Andreas Greiner, Infineon Technologies Dresden GmbH (Germany)
ChinTeong Lim, Infineon Technologies Dresden GmbH (Germany)
Vlad Temchenko, Infineon Technologies Dresden GmbH (Germany)
Felix Braun, Infineon Technologies Dresden GmbH (Germany)
Dieter Kaiser, Infineon Technologies Dresden GmbH (Germany)
Tarja Hauck, Infineon Technologies Dresden GmbH (Germany)
Ingo Meusel, Infineon Technologies Dresden GmbH (Germany)
Dietrich Burmeister, Infineon Technologies Dresden GmbH (Germany)
Stephan Loehr, Infineon Technologies Dresden GmbH (Germany)
Susanne Volkland, Infineon Technologies Dresden GmbH (Germany)
Astrid Bauch, Infineon Technologies Dresden GmbH (Germany)
Hendrik Kirbach, Infineon Technologies Dresden GmbH (Germany)
Daniel Sarlette, Infineon Technologies Dresden GmbH (Germany)
Katrin Thiede, Canon Deutschland GmbH (Germany)


Published in SPIE Proceedings Vol. 7640:
Optical Microlithography XXIII
Mircea V. Dusa; Will Conley, Editor(s)

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