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Proceedings Paper

Advanced patterning solutions based on the shrink process assisted by double exposure (SPADE)
Author(s): Young C. Bae; Yi Liu; Thomas Cardolaccia; Rosemary Bell; Ken Spizuoco; George G. Barclay
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Paper Abstract

By combining chemical and thermal curing techniques, we developed a simple "hybrid" curing system which offers precise CD control of the first patterns after double patterning. This hybrid curing system involves thermal curing followed by a liquid rinse process using a double patterning primer (DPP). DPP is an aqueous solution formulated with surface curing agent (SCA) components and enhances "positive" interaction between L1 and L2 patterns. Taking advantage of the CD growth with DPP treatment, we further developed three advanced patterning schemes: 1. "Shrink Process Assisted by Double Exposure" (SPADE I), 2. "Space Patterning Assisted by Double Exposure" (SPADE II), and 3. "Sidewall Patterning Assisted by Double Exposure" (SPADE III). Using SPADE I, contact hole CD was reduced by 10~30nm and excellent through pitch performance was achieved. Using SPADE II, the first example of self-aligned double patterning of contact holes has been demonstrated. After SPADE II, the contact hole pitch was reduced by 30%. A novel method was developed to form sidewalls on the existing patterns using SPADE III. The 2D sidewall patterning with contact holes was demonstrated and ~40nm sidewalls were formed using SPADE III. This can also be applied to form sidewall patterns on line and space patterns to self-aligned double patterning of lines. In this paper, our recent progress with SPADE technology is described and its potential use in the advanced patterning schemes is discussed.

Paper Details

Date Published: 25 March 2010
PDF: 10 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76390C (25 March 2010); doi: 10.1117/12.848047
Show Author Affiliations
Young C. Bae, Dow Electronic Materials (United States)
Yi Liu, Dow Electronic Materials (United States)
Thomas Cardolaccia, Dow Electronic Materials (United States)
Rosemary Bell, Dow Electronic Materials (United States)
Ken Spizuoco, Dow Electronic Materials (United States)
George G. Barclay, Dow Electronic Materials (United States)


Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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