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Proceedings Paper

High contact angle fluorosulfonamide-based materials for immersion lithography
Author(s): Daniel P. Sanders; Linda K. Sundberg; Masaki Fujiwara; Yoshiharu Terui; Manabu Yasumoto
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Paper Abstract

Fluoroalcohol-containing materials have found considerable use in 193 nm immersion topcoat and topcoat-free immersion resist materials due to their good water contact angles and base-dissolution properties. Trifluoromethanesulfonamide-containing materials are another alternative which have been explored for use in 193 nm photoresist and immersion topcoat applications; however, fluorosulfonamide materials have suffered from issues such as low water contact angles. In this paper, we report the synthesis of a series of fluorosulfonamide-containing methacrylate materials with water contact angle and base dissolution performance that rivals or exceeds that of comparable fluoroalcohol-based materials.

Paper Details

Date Published: 30 March 2010
PDF: 8 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763925 (30 March 2010); doi: 10.1117/12.847257
Show Author Affiliations
Daniel P. Sanders, IBM Almaden Research Ctr. (United States)
Linda K. Sundberg, IBM Almaden Research Ctr. (United States)
Masaki Fujiwara, Central Glass International, Inc. (United States)
Yoshiharu Terui, Central Glass International, Inc. (United States)
Manabu Yasumoto, Central Glass International, Inc. (United States)


Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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