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Proceedings Paper

Metrology data cleaning and statistical assessment flow for modeling applications
Author(s): Brian S. Ward; Sylvain Berthiaume; Travis Brist; Peter Brooker
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Paper Abstract

Modern OPC modeling relies on substantial volumes of metrology data to meet pattern coverage and precision requirements. This data must be reviewed and cleaned prior to model calibration to prevent bad data from adversely affecting calibration. We propose implementing specific tools in the metrology flow to improve metrology engineering efficiency and resulting data quality. The metrology flow with and without these tools will be discussed, and the inherent tradeoffs will be identified. To demonstrate the benefit of the proposed flow, engineering efficiency and the impact of better data on model calibration will be quantified.

Paper Details

Date Published: 2 April 2010
PDF: 11 pages
Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 76381W (2 April 2010); doi: 10.1117/12.847042
Show Author Affiliations
Brian S. Ward, Synopsys, Inc. (United States)
Sylvain Berthiaume, Synopsys, Inc. (Canada)
Travis Brist, Synopsys, Inc. (United States)
Peter Brooker, Synopsys, Inc. (United States)


Published in SPIE Proceedings Vol. 7638:
Metrology, Inspection, and Process Control for Microlithography XXIV
Christopher J. Raymond, Editor(s)

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