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Proceedings Paper

Evaluation of double-patterning techniques for advanced logic nodes
Author(s): Chiew-Seng Koay; Steven Holmes; Karen Petrillo; Matthew Colburn; Sean Burns; Shannon Dunn; Jason Cantone; David Hetzer; Shinichiro Kawakami; Youri van Dommelen; Aiqin Jiang; Michael Many; Robert Routh; Lior Huli; Brian Martinick; Martin Rodgers; Hideyuki Tomizawa; Sumanth Kini
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Paper Abstract

The development of Double-Patterning (DP) techniques continues to push forward aiming to extend the immersion based lithography below 36 nm half pitch. There are widespread efforts to make DP viable for further scaling of semiconductor devices. We have developed Develop/Etch/Develop/Etch (DE2) and Double-Expose-Track-Optimized (DETO) techniques for producing pitch-split patterns capable of supporting semiconductor devices for the 16 nm and 11 nm nodes. The IBM Alliance has established a DETO baseline, in collaboration with ASML, TEL, CNSE, and KLATencor, to evaluate the manufacturability of DETO by using commercially available resist systems. Presented in this paper are the long-term performance results of these systems relevant to defectivity, overlay, and CD uniformity.

Paper Details

Date Published: 3 March 2010
PDF: 10 pages
Proc. SPIE 7640, Optical Microlithography XXIII, 764009 (3 March 2010); doi: 10.1117/12.846769
Show Author Affiliations
Chiew-Seng Koay, IBM Corp. (United States)
Steven Holmes, IBM Corp. (United States)
Karen Petrillo, IBM Corp. (United States)
Matthew Colburn, IBM Corp. (United States)
Sean Burns, IBM Corp. (United States)
Shannon Dunn, Tokyo Electron Technology Ctr., America, LLC (United States)
Jason Cantone, Tokyo Electron America, Inc. (United States)
David Hetzer, Tokyo Electron Technology Ctr., America, LLC (United States)
Shinichiro Kawakami, Tokyo Electron Technology Ctr., America, LLC (United States)
Youri van Dommelen, ASML (United States)
Aiqin Jiang, ASML (United States)
Michael Many, ASML (United States)
Robert Routh, ASML (United States)
Lior Huli, Univ. at Albany, SUNY (United States)
Brian Martinick, Univ. at Albany, SUNY (United States)
Martin Rodgers, Univ. at Albany, SUNY (United States)
Hideyuki Tomizawa, Toshiba (United States)
Sumanth Kini, KLA-Tencor (United States)


Published in SPIE Proceedings Vol. 7640:
Optical Microlithography XXIII
Mircea V. Dusa; Will Conley, Editor(s)

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