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Proceedings Paper

Predicting and reducing substrate induced focus error
Author(s): Bernhard Liegl; Brian Sapp; Kia Low; Stephen Greco; Timothy Brunner; Nelson Felix; Ian Stobert; Kourosh Nafisi; Chandrasekhar Sarma
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Paper Abstract

The ever shrinking lithography process window requires us to maximize our process window and minimize tool-induced process variation, and also to quantify the disturbances to an imaging process caused upstream of the imaging step. Relevant factors include across-wafer and wafer-to-wafer film thickness variation, wafer flatness, wafer edge effects, and design-induced topography. We quantify these effects and their interactions, and present efforts to reduce their harm to the imaging process. We also present our effort to predict design-induced focus error hot spots at the edge of our process window. The collaborative effort is geared towards enabling a constructive discussion with our design team, thus allowing us to prevent or mitigate focus error hot spots upstream of the imaging process.

Paper Details

Date Published: 3 March 2010
PDF: 12 pages
Proc. SPIE 7640, Optical Microlithography XXIII, 76400Z (3 March 2010); doi: 10.1117/12.846768
Show Author Affiliations
Bernhard Liegl, IBM Corp. (United States)
Brian Sapp, IBM Corp. (United States)
Kia Low, IBM Corp. (United States)
Stephen Greco, IBM Corp. (United States)
Timothy Brunner, IBM Corp. (United States)
Nelson Felix, IBM Corp. (United States)
Ian Stobert, IBM Corp. (United States)
Kourosh Nafisi, IBM Corp. (United States)
Chandrasekhar Sarma, Infineon Technologies (United States)


Published in SPIE Proceedings Vol. 7640:
Optical Microlithography XXIII
Mircea V. Dusa; Will Conley, Editor(s)

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