Share Email Print

Proceedings Paper

Evolution of thermal cure resist for double patterning applications
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

To extend immersion based lithography to below 32nm half pitch, the implementation of Double-Patterning lithography requires that cost be contained by as many means possible. In addition to CDU and defectivity, simplifying the process flow is a viable approach to helping accomplish cost containment. For Litho-Litho-Etch processes, this entails replacing the flows that require spin-on chemical freeze with a solely thermally cured resist approach, thereby eliminating materials and several process steps from the flow. As part of ongoing efforts to allow Double-Patterning techniques to further scale semiconductor devices, we use DETO (Double-Expose-Track-Optimized) methods for producing pitch-split patterns capable of supporting 16 and 11-nm node semiconductor devices. In this paper we present the assessment from a series of thermal cure double-patterning resist systems; with a focus on process latitude, CDU, and resolution limit.

Paper Details

Date Published: 26 March 2010
PDF: 7 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76392W (26 March 2010); doi: 10.1117/12.846748
Show Author Affiliations
Michael Reilly, The Dow Chemical Company (United States)
Young C. Bae, The Dow Chemical Company (United States)
Vaishali Vohra, The Dow Chemical Company (United States)
Chiew-Seng Koay, IBM Corp. (United States)
Matthew Colburn, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

© SPIE. Terms of Use
Back to Top