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Proceedings Paper

3D-AFM tip to tip variations and impact on measurement performances
Author(s): A.-L. Foucher; J. Foucher; L. Dourthe
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Paper Abstract

The CD metrology requirements for advanced node developments and process control are becoming more and more restrictive with shrinkage of dimensions. Currently in R&D, and more particularly in the process development in lithography or etching step, we have to cope with sub-40nm trenches CD measurements for sub-28nm nodes development. For such requirements, we are using the 3D-AFM technology as a complementary technique to CD-SEM. Indeed, as CD-SEM is limited in giving accurate information about profiles, the 3D-AFM technology must be considered. To succeed in measuring on a repeatable way and accurately sub-40nm trenches and contact holes, the 3D-AFM tips diameter has to be manufactured within tight specifications and the relative accuracy tip to tip must remains constant and reliable. In this paper, we will present a large set of data related to the use of various 3D-AFM tip models (diameter, tip edge, tip material, stiffness...) from large model to tiny model with typical tip diameter of 28nm. We compare the performances of each model in term of accuracy and repeatability, and extrapolate the industrial requirements that are necessary for tip manufacturing in order to be compatible with advanced roadmap requirements. Finally, we will present as function of tip model the relative accuracy of CD measurements.

Paper Details

Date Published: 1 April 2010
PDF: 9 pages
Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 76381Z (1 April 2010); doi: 10.1117/12.846731
Show Author Affiliations
A.-L. Foucher, CEA-LETI MINATEC (France)
J. Foucher, CEA-LETI MINATEC (France)
L. Dourthe, CEA-LETI MINATEC (France)

Published in SPIE Proceedings Vol. 7638:
Metrology, Inspection, and Process Control for Microlithography XXIV
Christopher J. Raymond, Editor(s)

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