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Proceedings Paper

Design and development of production-worthy developable BARCs(DBARCs) for implant lithography
Author(s): James Cameron; John Amara; Jin Wuk Sung; David Valeri; Adam Ware; Kevin O'Shea; Yoshihiro Yamamoto; Hiroaki Kitaguchi; Libor Vyklicky; Irene Popova; Pushkara R. Varanasi
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Paper Abstract

As device scaling continues according to Moore's Law, an ongoing theme in the semiconductor industry is the need for robust patterning solutions for advanced device manufacture. One particularly attractive solution for implant lithography is the use of a developable BARC (DBARC) to improve reflection control while still affording an "implant ready" substrate following development. Going forward, these two features of DBARC technology are key to successful implant patterning as the industry standard TARC process begins to falter due to poor substrate reflection control leading to profile degradation, shrinking process windows and poor CDU. In this paper, we report our progress in the design and development of production worthy DBARCs for implant lithography. In addition to outlining our general design concepts, we describe our fundamental approach to characterizing DBARCs and share key performance data showing our DBARC technology is surpassing the capability of a traditional TARC process for both KrF and ArF implant applications. Key performance metrics include CD swing, CD control over varying oxide thickness, active to field CD bias and footing over topography.

Paper Details

Date Published: 26 March 2010
PDF: 12 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76390H (26 March 2010); doi: 10.1117/12.846708
Show Author Affiliations
James Cameron, Dow Electronic Materials (United States)
John Amara, Dow Electronic Materials (United States)
Jin Wuk Sung, Dow Electronic Materials (United States)
David Valeri, Dow Electronic Materials (United States)
Adam Ware, Dow Electronic Materials (United States)
Kevin O'Shea, Dow Electronic Materials (United States)
Yoshihiro Yamamoto, Dow Electronic Materials (Japan)
Hiroaki Kitaguchi, Dow Electronic Materials (Japan)
Libor Vyklicky, IBM Corp. (United States)
Irene Popova, IBM Corp. (United States)
Pushkara R. Varanasi, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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