Share Email Print
cover

Proceedings Paper

Concerning the influence of pattern symmetry on CD-SEM local overlay measurements for double patterning of complex shapes
Author(s): Shoji Hotta; Takumichi Sutani; Akiyuki Sugiyama; Masahiko Ikeno; Atsuko Yamaguchi; Kazuyoshi Torii; Scott Halle; Daniel Moore; Chas Archie
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We have developed a new local overlay measurement technique on actual device patterns using critical dimension scanning electron microscope (CD-SEM), which can be applied to 2D device structures such as an SRAM contact hole array or more complex shapes. CD-SEM overlay measurement can provide additional local overlay information at the site of device patterns, complementary to the conventional optical overlay data. The methodology includes the use of symmetrically arranged patterns to cancel out many process effects and reduce measurement uncertainty. The developed methodology was applied to local overlay measurement of double patterning contact hole layers of leading edge devices. Local overlay distribution was successfully captured on device structures on different length scale, and the result shows the possibility of assessing process induced shift on device structures and collecting denser sampling for better intra-chip overlay control. The measurement uncertainty of CD-SEM overlay metrology was assessed by comparing with conventional optical overlay metrology for 1D and 2D structures. Very good correlation was confirmed between SEM and optical overlay metrology with net residual error of ~1.1nm. Measurement variation associated with pattern roughness was analyzed for 1D structure, and identified as one of major variation sources for CD-SEM overlay metrology.

Paper Details

Date Published: 1 April 2010
PDF: 13 pages
Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 76381T (1 April 2010); doi: 10.1117/12.846674
Show Author Affiliations
Shoji Hotta, Hitachi America, Ltd. (United States)
Takumichi Sutani, Hitachi America, Ltd. (United States)
Akiyuki Sugiyama, Hitachi High-Technologies Corp. (Japan)
Masahiko Ikeno, Hitachi High-Technologies Corp. (Japan)
Atsuko Yamaguchi, Hitachi, Ltd. (Japan)
Kazuyoshi Torii, Hitachi, Ltd. (Japan)
Scott Halle, IBM Corp. (United States)
Daniel Moore, IBM Corp. (United States)
Chas Archie, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 7638:
Metrology, Inspection, and Process Control for Microlithography XXIV
Christopher J. Raymond, Editor(s)

© SPIE. Terms of Use
Back to Top