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Proceedings Paper

Controlling 2D aspect ratio of elliptical contact level interconnects utilizing spin-on and reactive ion etch critical dimension shrink for the 22-nm node
Author(s): Andrew Metz; Shannon Dunn; Dave Hetzer; Jason Cantone; Shinichiro Kawakami; Tom Winter; Karen Petrillo; Dave Horak; Susan Fan; Matthew Colburn
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Paper Abstract

Litho-Etch-Litho-Etch double patterning requires aggressive shrink of each sub-pattern's critical dimensions to enable inter-digitation and pitch doubling. Application of this double patterning technique to elliptical contacts introduces a new constraint to the CD shrink processes as controlling the 2-D aspect ratio of elliptical contacts is critical for both device performance and yield. The impact of a track-applied chemical shrink and reactive ion etch [RIE] shrink processes to pre/post RIE 2-D aspect ratios [2-D AR] have been evaluated. A methodology for controlling 2-D aspect ratios with an aggressive CD shrink target is described using a 2:1 aspect ratio test pattern resulting in the successful fabrication of 2:1 aspect ratio bottom CD contacts with 65% bias from the lithographic CD.

Paper Details

Date Published: 25 March 2010
PDF: 7 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76392Z (25 March 2010); doi: 10.1117/12.846625
Show Author Affiliations
Andrew Metz, Tokyo Electron Technology Ctr., America, LLC (United States)
Shannon Dunn, Tokyo Electron Technology Ctr., America, LLC (United States)
Dave Hetzer, Tokyo Electron Technology Ctr., America, LLC (United States)
Jason Cantone, Tokyo Electron Technology Ctr., America, LLC (United States)
Shinichiro Kawakami, Tokyo Electron Technology Ctr., America, LLC (United States)
Tom Winter, Tokyo Electron America, Inc. (United States)
Karen Petrillo, IBM Corp. (United States)
Dave Horak, IBM Corp. (United States)
Susan Fan, IBM Corp. (United States)
Matthew Colburn, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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