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Proceedings Paper

Tin DPP source collector module (SoCoMo): status of Beta products and HVM developments
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Paper Abstract

For industrial EUV (extreme ultra-violet) lithography applications high power EUV light sources are needed at a central wavelength of 13.5 nm. Philips Extreme UV GmbH, EUVA and XTREME technologies GmbH have jointly developed tin DPP (Discharge Produced Plasma) source systems. This paper focuses in the first part on the results achieved from the Alpha EUV sources in the field. After integration of power upgrades in the past, now the focus is on reliability and uptime of the systems. The second part of this paper deals with the Beta SoCoMo that can be used in the first pre-production scanner tools of the lithography equipment makers. The performance will be shown in terms of power at Intermediate Focus, dose stability and product reliability but also its reachable collector lifetime, the dominant factor for Cost of Operation. In the third part of the paper the developments for the high volume manufacturing (HVM) phase are described. The basic engineering challenges in thermal scaling of the source and in debris mitigation can be proven to be solvable in practice based on the Beta implementation and related modeling calibrated with these designs. Further efficiency improvements required for the HVM phase will also be shown based on experiments. The further HVM roadmap can thus be realized as evolutionary steps from the Beta products.

Paper Details

Date Published: 20 March 2010
PDF: 12 pages
Proc. SPIE 7636, Extreme Ultraviolet (EUV) Lithography, 763610 (20 March 2010); doi: 10.1117/12.846545
Show Author Affiliations
Masaki Yoshioka, XTREME technologies GmbH (Germany)
Yusuke Teramoto, EUVA (Japan)
Peter Zink, Philips Extreme UV GmbH (Germany)
Guido Schriever, XTREME technologies GmbH (Germany)
Gota Niimi, EUVA (Japan)
Marc Corthout, Philips Extreme UV GmbH (Germany)


Published in SPIE Proceedings Vol. 7636:
Extreme Ultraviolet (EUV) Lithography
Bruno M. La Fontaine, Editor(s)

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