Share Email Print

Proceedings Paper

Design intention application to tolerance-based manufacturing system
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Continuous shrinkage of design rule (DR) in ultra-large-scale integrated circuit (ULSI) devices brings about greater difficulty in the manufacturing process. The keys to meeting small process margin are adequate extraction of critical dimension (CD) tolerance for each object and budgeting the tolerance for each process step. Furthermore, to extract adequate tolerance, design intent in terms of electrical behavior should be carefully considered. Electrical behavior is carefully verified in both cell and chip design phases with respect to timing, IR drop, signal integrity, crosstalk, etc., using various electronic design automation (EDA) tools. However, once the design data is converted to layout data and signed off, most of the design intention is abandoned and unrecognized in the process phase. Thus, instead of essential tolerance according to layout-related design intention, uniform and redundant tolerance is used, and therefore excess tolerance is assigned for some layouts. To solve the problem described above, a tolerance-based manufacturing system utilizing flexible layout-dependent speculation derived from design intention has been discussed. In this paper, a test flow is developed and application to 45nm node test chip is examined.

Paper Details

Date Published: 2 April 2010
PDF: 7 pages
Proc. SPIE 7641, Design for Manufacturability through Design-Process Integration IV, 76410L (2 April 2010); doi: 10.1117/12.846542
Show Author Affiliations
Sachiko Kobayashi, Toshiba Corp. (Japan)
Satoshi Tanaka, Toshiba Corp. (Japan)
Suigen Kyoh, Toshiba Corp. (Japan)
Shimon Maeda, Toshiba Corp. (Japan)
Masanari Kajiwara, Toshiba Corp. (Japan)
Soichi Inoue, Toshiba Corp. (Japan)
Koji Nakamae, Osaka Univ. (Japan)

Published in SPIE Proceedings Vol. 7641:
Design for Manufacturability through Design-Process Integration IV
Michael L. Rieger; Joerg Thiele, Editor(s)

© SPIE. Terms of Use
Back to Top