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Proceedings Paper

Productivity improvement in the wafer bevel and backside cleaning before exposure
Author(s): Yoichi Tokunaga; Shuuichi Nishikido; Kousuke Yoshihara; Zoe Hong; Marlene Strobl; Yu Chen Lin
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Paper Abstract

The Back-side Surface Treatment ("BST") is a module that cleans the backside of a wafer just before a process on the exposure system. To support immersion lithography, Tokyo Electron introduces a bevel cleaning function to this module. This enables cleaning of both wafer backside and bevel section at the same time. We evaluate the new BST module for wafer cleaning performance, wafer backside cleaning performance and wafer topside particle control performance. The effectiveness of the BST module is tested in an actual production line. It is proved that the introduction of the BST module reduces defocus and blocked images.

Paper Details

Date Published: 30 March 2010
PDF: 9 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763924 (30 March 2010); doi: 10.1117/12.846488
Show Author Affiliations
Yoichi Tokunaga, Tokyo Electron Kyushu Ltd. (Japan)
Shuuichi Nishikido, Tokyo Electron Kyushu Ltd. (Japan)
Kousuke Yoshihara, Tokyo Electron Kyushu Ltd. (Japan)
Zoe Hong, Tokyo Electron Taiwan Ltd. (Taiwan)
Marlene Strobl, Inotera Memories, Inc. (Taiwan)
Yu Chen Lin, Inotera Memories, Inc. (Taiwan)


Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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