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Proceedings Paper

The analysis of EUV mask defects using a wafer defect inspection system
Author(s): Kyoung-Yong Cho; Joo-On Park; Changmin Park; Young-Mi Lee; In-Yong Kang; Jeong-Ho Yeo; Seong-Woon Choi; Chan-Hoon Park; Steven R. Lange; SungChan Cho; Robert M. Danen; Gregory L. Kirk; Yeon-Ho Pae
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Paper Abstract

EUVL is the strongest candidate for a sub-20nm lithography solution after immersion double-patterning. There are still critical challenges for EUVL to address to become a mature technology like today's litho workhorse, ArF immersion. Source power and stability, resist resolution and LWR (Line Width Roughness), mask defect control and infrastructure are listed as top issues. Source power has shown reasonably good progress during the last two years. Resist resolution was proven to resolve 32nm HP (Half Pitch) lines and spaces with good process windows even though there are still concerns with LWR. However, the defectivity level of blank masks is still three orders of magnitude higher than the requirement as of today. In this paper, mask defect control using wafer inspection is studied as an alternative solution to mask inspection for detection of phase defects on the mask. A previous study suggested that EUVL requires better defect inspection sensitivity than optical lithography because EUVL will print smaller defects. Improving the defect detection capability involves not only inspection system but also wafer preparation. A few parameters on the wafer, including LWR and wafer stack material and thickness are investigated, with a goal of enhancing the defect capture rate for after development inspection (ADI) and after cleaning inspection (ACI). In addition to defect sensitivity an overall defect control methodology will be suggested, involving mask, mask inspection, wafer print and wafer inspection.

Paper Details

Date Published: 20 March 2010
PDF: 15 pages
Proc. SPIE 7636, Extreme Ultraviolet (EUV) Lithography, 76361E (20 March 2010); doi: 10.1117/12.846482
Show Author Affiliations
Kyoung-Yong Cho, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Joo-On Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Changmin Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Young-Mi Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
In-Yong Kang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jeong-Ho Yeo, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Seong-Woon Choi, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Chan-Hoon Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Steven R. Lange, KLA-Tencor Corp. (United States)
SungChan Cho, KLA-Tencor Corp. (United States)
Robert M. Danen, KLA-Tencor Corp. (United States)
Gregory L. Kirk, KLA-Tencor Corp. (United States)
Yeon-Ho Pae, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7636:
Extreme Ultraviolet (EUV) Lithography
Bruno M. La Fontaine, Editor(s)

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