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Proceedings Paper

Simultaneous optimization of dose and focus controls in advanced ArF immersion scanners
Author(s): Tsuyoshi Toki; Pavel Izikson; Junichi Kosugi; Naruo Sakasai; Keiko Saotome; Kazuaki Suzuki; Daniel Kandel; John C. Robinson; Yuji Koyanagi
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Paper Abstract

We have developed a new scheme of process control combining a CD metrology system and an exposure tool. A new model based on Neural Networks has been created in KLA-Tencor's "KT Analyzer" which calculates the dose and focus errors simultaneously from CD parameters, such as mid CD and height information, measured by a scatterometry (OCD) measurement tool. The accuracy of this new model was confirmed by experiment. Nikon's "CDU master" then calculated the control parameters for dose and focus per each field from the dose and focus error data of a reference wafer provided by KT Analyzer. Using the corrected parameters for dose and focus from CDU master, we exposed wafers on an NSR-S610C (ArF immersion scanner), and measured the CDU on a KLA SCD100 (OCD tool). As a result, we confirmed that CDU in the entire wafer can be improved more than 60% (from 3.36nm (3σ) to 1.28nm (3σ)).

Paper Details

Date Published: 10 March 2010
PDF: 8 pages
Proc. SPIE 7640, Optical Microlithography XXIII, 764016 (10 March 2010); doi: 10.1117/12.846413
Show Author Affiliations
Tsuyoshi Toki, Nikon Corp. (Japan)
Pavel Izikson, KLA-Tencor Corp. Israel (Israel)
Junichi Kosugi, Nikon Corp. (Japan)
Naruo Sakasai, Nikon Corp. (Japan)
Keiko Saotome, Nikon Corp. (Japan)
Kazuaki Suzuki, Nikon Corp. (Japan)
Daniel Kandel, KLA-Tencor Corp. Israel (Israel)
John C. Robinson, KLA-Tencor Corp. (United States)
Yuji Koyanagi, KLA-Tencor Japan (Japan)

Published in SPIE Proceedings Vol. 7640:
Optical Microlithography XXIII
Mircea V. Dusa; Will Conley, Editor(s)

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