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Proceedings Paper

Overlay characterization and matching of immersion photoclusters
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Paper Abstract

Many factors are driving a significant tightening of the overlay budget for advanced technology nodes, e.g. 6nm [mean + 3σ] for 22nm node. Exposure tools will be challenged to support this goal, even with tool dedication. However, tool dedication has adverse impact on cycle time reduction, line productivity and cost issues. There is a strong desire to have tool to tool (and chuck to chuck) matching performance, which supports the tight overlay budgets without tool dedication. In this paper we report improvements in overlay metrology test methods and analysis methods which support the needed exposure tool overlay capability.

Paper Details

Date Published: 3 March 2010
PDF: 11 pages
Proc. SPIE 7640, Optical Microlithography XXIII, 76400W (3 March 2010); doi: 10.1117/12.846408
Show Author Affiliations
Blandine Minghetti, STMicroelectronics (United States)
Timothy Brunner, IBM SRDC (United States)
Christopher Robinson, IBM SRDC (United States)
Christopher Ausschnitt, IBM SRDC (United States)
Dan Corliss, IBM SRDC (United States)
Nelson Felix, IBM SRDC (United States)


Published in SPIE Proceedings Vol. 7640:
Optical Microlithography XXIII
Mircea V. Dusa; Will Conley, Editor(s)

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