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Proceedings Paper

Process optimization consideration for 193nm developable bottom anti-reflective coatings (DBARCs)
Author(s): Takanori Kudo; Srinivasan Chakrapani; Alberto Dioses; Edward Ng; Charito Antonio; Deepa Parthasarathy; Richard Collett; Mark Neisser; Munirathna Padmanaban
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Paper Abstract

Developable BARCs (DBARCs) are useful for implant layers because they eliminate the plasma etch step avoiding damage to the plasma sensitive layers during implantation. It is expected that DBARC will also be used for non-implant layers and double exposure technology. AZ has pioneered DBARC based on photosensitive cleave as well as crosslink/decrosslink mechanisms. In this paper, we focus on various processing factors for 193nm DBARC and discuss the influences of prewet, thickness, topography and substrates on lithographic performance. Prewet of DBARC before resist coating deteriorated performance, however, it was resolved by modifying DBARC formulations. The optimized DBARC showed both optical and lithographic performance comparable to conventional BARCs. DBARCs minimized reflection from the substrates and notching of patterns was improved observed on silicon oxide topography. This paper includes simulation, DBARC contrast curve analyses, and recent dry and immersion exposure results of DBARC.

Paper Details

Date Published: 31 March 2010
PDF: 9 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763928 (31 March 2010); doi: 10.1117/12.846313
Show Author Affiliations
Takanori Kudo, AZ Electronic Materials USA Corp. (United States)
Srinivasan Chakrapani, AZ Electronic Materials USA Corp. (United States)
Alberto Dioses, AZ Electronic Materials USA Corp. (United States)
Edward Ng, AZ Electronic Materials USA Corp. (United States)
Charito Antonio, AZ Electronic Materials USA Corp. (United States)
Deepa Parthasarathy, AZ Electronic Materials USA Corp. (United States)
Richard Collett, AZ Electronic Materials USA Corp. (United States)
Mark Neisser, AZ Electronic Materials USA Corp. (United States)
Munirathna Padmanaban, AZ Electronic Materials USA Corp. (United States)


Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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