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Proceedings Paper

Automation of sample plan creation for process model calibration
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Paper Abstract

The process of preparing a sample plan for optical and resist model calibration has always been tedious. Not only because it is required to accurately represent full chip designs with countless combinations of widths, spaces and environments, but also because of the constraints imposed by metrology which may result in limiting the number of structures to be measured. Also, there are other limits on the types of these structures, and this is mainly due to the accuracy variation across different types of geometries. For instance, pitch measurements are normally more accurate than corner rounding. Thus, only certain geometrical shapes are mostly considered to create a sample plan. In addition, the time factor is becoming very crucial as we migrate from a technology node to another due to the increase in the number of development and production nodes, and the process is getting more complicated if process window aware models are to be developed in a reasonable time frame, thus there is a need for reliable methods to choose sample plans which also help reduce cycle time. In this context, an automated flow is proposed for sample plan creation. Once the illumination and film stack are defined, all the errors in the input data are fixed and sites are centered. Then, bad sites are excluded. Afterwards, the clean data are reduced based on geometrical resemblance. Also, an editable database of measurement-reliable and critical structures are provided, and their percentage in the final sample plan as well as the total number of 1D/2D samples can be predefined. It has the advantage of eliminating manual selection or filtering techniques, and it provides powerful tools for customizing the final plan, and the time needed to generate these plans is greatly reduced.

Paper Details

Date Published: 4 March 2010
PDF: 9 pages
Proc. SPIE 7640, Optical Microlithography XXIII, 76401G (4 March 2010); doi: 10.1117/12.846276
Show Author Affiliations
James Oberschmidt, IBM Microelectronics (India)
Amr Abdo, IBM Microelectronics (United States)
Tamer Desouky, Mentor Graphics Corp. (Egypt)
Mohamed Al-Imam, Mentor Graphics Corp. (Egypt)
Azalia Krasnoperova, IBM Microelectronics (United States)
Ramya Viswanathan, IBM Microelectronics (United States)

Published in SPIE Proceedings Vol. 7640:
Optical Microlithography XXIII
Mircea V. Dusa; Will Conley, Editor(s)

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