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Proceedings Paper

Minimizing the outgassing of spin-coated organic materials to reduce defects
Author(s): Brandy Carr; April Evers; Marc Weimer; Brian Smith; Jeff Leith
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Paper Abstract

Maintaining low-defect spin-applied films is paramount to the success of semiconductor manufacturing. While some spin-on films have a low number of defects as coated, defect levels can rise with the number of wafers processed. Thin organic films may outgas or sublime during the post-coat baking process, or even during subsequent exposures to deep or extreme ultraviolet radiation. If these outgassing components collect on the lid of the hot plate chamber, there is an increased risk of "fall-on" defects on subsequently processed wafers. To increase throughput, preventive maintenance and cleaning schedules are pushed to the limit to provide maximum output from the track. New materials must be designed to produce minimal outgassing to ensure maximum throughput without defects. Early tests for measuring outgassing provided qualitative results gained from collecting the condensed outgassing components on a quartz wafer and measuring the absorbance of the resulting film. A more advanced technique involves the use of a newly designed quartz crystal microbalance (QCM) to more carefully quantify the amount of outgassing.[1] As the industry continues to mature, more sensitive measurements are required to design new materials with even lower outgassing from sublimation. The inverted wafer test and the QCM techniques provide complementary information about outgassing and together provide a better overall prediction of the defectforming potential than either technique alone.

Paper Details

Date Published: 2 April 2010
PDF: 7 pages
Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 763823 (2 April 2010); doi: 10.1117/12.846102
Show Author Affiliations
Brandy Carr, Brewer Science, Inc. (United States)
April Evers, Brewer Science, Inc. (United States)
Marc Weimer, Brewer Science, Inc. (United States)
Brian Smith, Brewer Science, Inc. (United States)
Jeff Leith, Brewer Science, Inc. (United States)


Published in SPIE Proceedings Vol. 7638:
Metrology, Inspection, and Process Control for Microlithography XXIV
Christopher J. Raymond, Editor(s)

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