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Proceedings Paper

Resist material for negative tone development process
Author(s): Shinji Tarutani; Sou Kamimura; Yuuichiro Enomoto; Keita Katou
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Paper Abstract

Methods for improving lithography performance with optimization of resist materials and formulation for negative tone development (NTD) process are discussed. Narrow pitch lithography performance comparison with NTD and PTD process for initial platform for NTD revealed the not enough maturity of the resist for NTD. Dissolution rate study suggested the optimizations of molecular weight and solvent parameter to NTD process are important to improve dissolution property. Larger dissolution rate and larger γ value in contrast curve gave larger process window at 40 nm half pitch dense contact hole pattern with double exposure and single development step.

Paper Details

Date Published: 25 March 2010
PDF: 8 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763904 (25 March 2010); doi: 10.1117/12.846026
Show Author Affiliations
Shinji Tarutani, FUJIFILM Corp. (Japan)
Sou Kamimura, FUJIFILM Corp. (Japan)
Yuuichiro Enomoto, FUJIFILM Corp. (Japan)
Keita Katou, FUJIFILM Corp. (Japan)


Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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