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Proceedings Paper

High-accuracy OPC-modeling by using advanced CD-SEM based contours in the next-generation lithography
Author(s): Daisuke Hibino; Hiroyuki Shindo; Yuichi Abe; Yutaka Hojyo; Germain Fenger; Thuy Do; Ir Kusnadi; John L. Sturtevant; Peter De Bisschop; Jeroen Van de Kerkhove
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Paper Abstract

OPC-modeling is traditionally based on CD-measurements. As design rules shrink, and process window become smaller, there is an unavoidable increase in the complexity of OPC/RET schemes required to enable design printability. The number of measurement points for OPC-modeling has increased to several hundred points per layer, and metrology requirements are no longer limited to simple one-dimensional measurements. Contour-based OPC-modeling has recently arisen as an alternative to the conventional CD-based method. In this paper, the technology of contour alignment and averaging was extended to arbitrary 2D structures. Furthermore the quality of SEM-contours was significantly improved in cases where the image has both horizontal and vertical edges (as is the case for most 2D structures), by a new SEM image method, which we call 'Fine SEM Edge'. OPC model calibration was done using SEM-contours from 2D structures. Then, the effectiveness of Contour-based calibration was examined by doing OPC model verification. The experimental results of the model quality with innovative SEM-contours with Fine SEM Edge (FSE) and Advanced alignment and averaging that was developed by Hitachi High-Technologies are reported. This combination of advanced alignment and averaging and FSE technologies makes the best use of the advantage of the contour-based OPC-modeling, and should be of use for the next generation lithography.

Paper Details

Date Published: 2 April 2010
PDF: 11 pages
Proc. SPIE 7638, Metrology, Inspection, and Process Control for Microlithography XXIV, 76381X (2 April 2010); doi: 10.1117/12.846025
Show Author Affiliations
Daisuke Hibino, Hitachi High-Technologies Corp. (Japan)
Hiroyuki Shindo, Hitachi High-Technologies Corp. (Japan)
Yuichi Abe, Hitachi High-Technologies Corp. (Japan)
Yutaka Hojyo, Hitachi High-Technologies Corp. (Japan)
Germain Fenger, Mentor Graphics Corp. (United States)
Thuy Do, Mentor Graphics Corp. (United States)
Ir Kusnadi, Mentor Graphics Corp. (United States)
John L. Sturtevant, Mentor Graphics Corp. (United States)
Peter De Bisschop, IMEC (Belgium)
Jeroen Van de Kerkhove, IMEC (Belgium)


Published in SPIE Proceedings Vol. 7638:
Metrology, Inspection, and Process Control for Microlithography XXIV
Christopher J. Raymond, Editor(s)

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