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Proceedings Paper

Particle protection capability of SEMI-compliant EUV-pod carriers
Author(s): George Huang; Long He; John Lystad; Tom Kielbaso; Cecilia Montgomery; Frank Goodwin
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Paper Abstract

With the projected rollout of pre-production extreme ultraviolet lithography (EUVL) scanners in 2010, EUVL pilot line production will become a reality in wafer fabrication companies. Among EUVL infrastructure items that must be ready, EUV mask carriers remain critical. To keep non-pellicle EUV masks free from particle contamination, an EUV pod concept has been extensively studied. Early prototypes demonstrated nearly particle-free results at a 53 nm PSL equivalent inspection sensitivity during EUVL mask robotic handling, shipment, vacuum pump-purge, and storage. After the passage of SEMI E152, which specifies the EUV pod mechanical interfaces, standards-compliant EUV pod prototypes, including a production version inner pod and prototype outer pod, were built and tested. Their particle protection capability results are reported in this paper. A state-of-the-art blank defect inspection tool was used to quantify their defect protection capability during mask robotic handling, shipment, and storage tests. To ensure the availability of an EUV pod for 2010 pilot production, the progress and preliminary test results of pre-production EUV outer pods are reported as well.

Paper Details

Date Published: 22 March 2010
PDF: 11 pages
Proc. SPIE 7636, Extreme Ultraviolet (EUV) Lithography, 763625 (22 March 2010); doi: 10.1117/12.845957
Show Author Affiliations
George Huang, SEMATECH North (United States)
Long He, Intel Corp. (United States)
John Lystad, Entegris, Inc. (United States)
Tom Kielbaso, Entegris, Inc. (United States)
Cecilia Montgomery, SEMATECH North (United States)
Frank Goodwin, SEMATECH North (United States)

Published in SPIE Proceedings Vol. 7636:
Extreme Ultraviolet (EUV) Lithography
Bruno M. La Fontaine, Editor(s)

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